Small packaging structure and design method

The invention provides a small packaging structure and a design method, and belongs to the technical field of semiconductor packaging, a first pin and a first extension pin are connected through an extension line, and a fifth pin and a second extension pin are connected through an extension line. Performing wiring extension from the second pin, obliquely extending to a position perpendicular to the first extension pin on one side of the packaging frame, and then straightly extending to the first extension pin; carrying out wiring extension from the fifth pin, obliquely extending to a position, vertical to the second extension pin, on the other side of the packaging frame, and then straightly extending to the second extension pin; and front half-etching is carried out on the tips of the first pin, the third pin, the fourth pin and the sixth pin. According to the invention, the size of a chip capable of being packaged is increased, the packaging area is smaller, and the packaging density is improved; meanwhile,