Packaging structure and preparation method thereof

The invention discloses a packaging structure and a preparation method thereof. The packaging structure comprises a packaging substrate, the packaging substrate comprises a conductive layer located in the packaging substrate, and the conductive layer comprises at least one grounding conductive part; the chip is fixed on the first surface of the packaging substrate, the chip comprises at least one grounding end, and the grounding ends are electrically connected with the grounding conductive parts through the first through holes in a one-to-one correspondence manner; the first insulating layer covers the chip and at least part of the first surface of the packaging substrate; the outer metal layer covers the first insulating layer and at least part of the side surface of the packaging substrate; wherein the grounding conductive part extends to the side surface of the packaging substrate and is electrically connected with the outer metal layer. According to the packaging substrate, the area occupied by the ground