Techniques for beam expansion and collimation for photonic integrated circuits

Techniques for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an auxiliary die is bonded to the PIC die. A vertical coupler in the PIC die directs light from the waveguide to a plane mirror on a top side of the auxiliary die. The plane mirror reflects light toward a curved mirror defined in a bottom surface of the auxiliary die. The curved mirror collimates light from the waveguide. In another embodiment, a cavity is formed in the PIC die, and a curved mirror is formed in the cavity. A light beam from a waveguide in the PIC die is directed to a curved mirror that collimates the light beam. 公开了用于光子集成电路(PIC)的光束扩展和准直的技术。在一个实施例中，辅助管芯被接合到PIC管芯。PIC管芯中的垂直耦合器将来自波导的光引导到辅助管芯的顶侧上的平面镜。平面镜朝向限定在辅助管芯的底表面中的曲面镜反射光。曲面镜准直来自波导的光。在另一个实施例中，在PIC管芯中形成腔，并且在腔中形成曲面镜。来自PIC管芯中的波导的光束被引导到曲面镜，曲面镜准直该光束。