Organic silicon modified heat-conducting adhesive film and preparation method thereof

The invention discloses an organic silicon modified heat-conducting adhesive film and a preparation method thereof, and belongs to the technical field of heat-conducting adhesives, and the organic silicon modified heat-conducting adhesive film comprises an organic silicon modifier, a heat-conducting...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QI FENG, ZOU WENTAO, HUANG ZEREN, HUANG JIANHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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