Organic silicon modified heat-conducting adhesive film and preparation method thereof

The invention discloses an organic silicon modified heat-conducting adhesive film and a preparation method thereof, and belongs to the technical field of heat-conducting adhesives, and the organic silicon modified heat-conducting adhesive film comprises an organic silicon modifier, a heat-conducting material, epoxy resin, a solvent and a curing agent. The organic silicon modified heat-conducting adhesive film has better high and low temperature resistance, the heat-conducting material can improve the heat-conducting property of the film, the epoxy resin, the solvent and the curing agent are mixed to serve as the binder to enhance the binding power and stability of the film, and in a word, the organic silicon modified heat-conducting adhesive film has better heat-conducting property, heat transfer efficiency and stability and is wide in application prospect. 本发明公开了一种有机硅改性导热粘结膜及其制备方法，属于导热胶粘剂技术领域，包括有机硅改性剂、导热材料、环氧树脂、溶剂和固化剂，本发明的配方体系中有机硅改性剂可以提高导热膜的传热效率和稳定性，使膜具有更好的耐高低温性能，导热材料可以提高膜的导热性能，环氧树脂、溶剂和固化剂混合作为粘结剂可以增强膜的粘结力和稳定