COMPOSITION, POLYMER PREPARED FROM COMPOSITION, AND ELECTRONIC DEVICE COMPRISING POLYMER

The present application relates to a composition, a polymer prepared from the composition, and an electronic device comprising the polymer. The composition includes a first monomer including a hydroxyl group, a second monomer not including a hydroxyl group, a third monomer including a terminal heter...

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Bibliographische Detailangaben
Hauptverfasser:	LEE JUNG-IN, SON IN-TAE, LI SHIBIN, BYUN HO-YUN, LEE DONG-HYUN, KI BOO-KAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present application relates to a composition, a polymer prepared from the composition, and an electronic device comprising the polymer. The composition includes a first monomer including a hydroxyl group, a second monomer not including a hydroxyl group, a third monomer including a terminal heterocyclic group, a fourth monomer including an alkylene glycol group, an oligomer, a silane coupling agent, and a photoinitiator. 本申请涉及组合物、由所述组合物制备的聚合物以及包含所述聚合物的电子设备。所述组合物包含：包含羟基基团的第一单体、不包含羟基基团的第二单体、包含末端杂环基团的第三单体、包含亚烷基二醇基团的第四单体、低聚物、硅烷偶联剂和光引发剂。