Micro-electro-mechanical device and process for manufacturing micro-electro-mechanical device
The invention discloses a micro-electro-mechanical device and a process for manufacturing the micro-electro-mechanical device. A micro-electro-mechanical system device includes a support structure, a micro-electro-mechanical system die incorporating a microstructure and a connection structure betwee...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a micro-electro-mechanical device and a process for manufacturing the micro-electro-mechanical device. A micro-electro-mechanical system device includes a support structure, a micro-electro-mechanical system die incorporating a microstructure and a connection structure between the micro-electro-mechanical system die and the support structure. The connection structure includes a spacer structure joined to the support structure, and a membrane applied to a face of the spacer structure opposite the support structure. The spacer structure at least partially laterally defines a cavity, and the membrane extends over the cavity, maintaining a distance from the support structure. A microelectromechanical system die is bonded to the film on the cavity.
公开了微机电设备及制造微机电设备的工艺。一种微机电设备,包括支撑结构、微机电系统管芯,微机电系统管芯结合有微结构和微机电系统管芯与支撑结构之间的连接结构。连接结构包括接合到支撑结构的间隔结构,以及施加到间隔结构的与支撑结构相对的一个面上的膜。间隔结构至少部分地横向限定腔,并且膜在腔上延伸,与支撑结构保持一定距离。微机电系统管芯接合到腔上的膜。 |
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