Laser chip, manufacturing method thereof and laser equipment

The invention relates to a laser chip, a manufacturing method thereof and laser equipment. The laser chip comprises a substrate and a plurality of surface emitting lasers arranged on the substrate, the plurality of surface emitting lasers are sequentially arranged in series along a first direction, and the first direction is approximately perpendicular to the light emitting direction of the surface emitting lasers; the laser chip further comprises an N bonding pad and a power supply P bonding pad, the N bonding pad and the power supply P bonding pad are electrically connected with the two surface emitting lasers farthest in the first direction respectively, and the laser chip applies current to the multiple surface emitting lasers through the power supply P bonding pad and the N bonding pad. According to the laser chip, high-power output can be realized, and the light emitting efficiency and the heat dissipation performance are good. 本申请涉及一种激光芯片及其制造方法与激光设备。激光芯片包括衬底以及设于所述衬底上的多个面发射激光器，多个所述面发射激光器沿第一方向依次串联设置，所述第一