Frame and outer coaming for laser processing system
The present invention provides a frame for a laser processing module, characterized by comprising: a platform having an upper surface and a lower surface; an optical bridge spaced apart from the upper surface of the platform and extending over the upper surface; and a bridge support inserted between...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides a frame for a laser processing module, characterized by comprising: a platform having an upper surface and a lower surface; an optical bridge spaced apart from the upper surface of the platform and extending over the upper surface; and a bridge support inserted between the platform and the optical bridge and coupled to the platform and the optical bridge. At least one selected from the group consisting of the platform and the optical bridge includes a sandwich panel. The sandwich panel may include a first panel, a second panel, and a core interposed between the first panel and the second panel. The first plate and the second plate may be indirectly attached to each other by the core, and the core may define at least one channel extending between the first plate and the second plate. The sandwich panel may also include a first aperture formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second aperture formed at the exterior |
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