Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board

The present invention relates to a photosensitive resin composition for a permanent resist, comprising (A) an acid-modified vinyl-containing resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a curing agent, and (E) an inorganic filler comprising a surface-treated filler. 本发明涉及一种永久抗蚀剂...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA NAOKI, NOMOTO SHUJI, SAWAMOTO HAYATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition for a permanent resist, comprising (A) an acid-modified vinyl-containing resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a curing agent, and (E) an inorganic filler comprising a surface-treated filler. 本发明涉及一种永久抗蚀剂用的感光性树脂组合物，其含有(A)酸改性含乙烯基树脂、(B)弹性体、(C)光聚合引发剂、(D)固化剂及(E)包含表面处理填料的无机填料。