Driving backboard, preparation method thereof and display device
A driving backboard (90) comprises a substrate (311), a plurality of bonding pad groups (91) and a plurality of circuit groups (92), one circuit (921, 922) in each circuit group (92) is connected with one bonding pad (911, 912) in one bonding pad group (91), at least one bonding pad (911, 912) in th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A driving backboard (90) comprises a substrate (311), a plurality of bonding pad groups (91) and a plurality of circuit groups (92), one circuit (921, 922) in each circuit group (92) is connected with one bonding pad (911, 912) in one bonding pad group (91), at least one bonding pad (911, 912) in the bonding pad group (91) and a pattern of the circuit group (92) connected with the bonding pad (911, 912) define a circuit hollow-out area (92a), and the circuit hollow-out area (92a) comprises a plurality of circuit hollow-out areas (92a) arranged on the bonding pads (911, 912) respectively. The first line hollowed-out area (92a1) and the second line hollowed-out area (92a2) are arranged on the two sides of the first line hollowed-out area (92a1) along the second direction (X); the circuit board further comprises a first surface (311a) covering the substrate (311) and a plurality of circuit group reflecting layers (314), each windowing area (61) on the reflecting layers (314) comprises a first area (611), a secon |
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