Pad manufacturing method and system based on machine vision and medium
The embodiment of the invention provides a bonding pad manufacturing method and system based on machine vision and a medium, and the method comprises the steps: obtaining the image information of a PCB, and obtaining a laser sintering region; the PCB is positioned through the tool jig, and position...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention provides a bonding pad manufacturing method and system based on machine vision and a medium, and the method comprises the steps: obtaining the image information of a PCB, and obtaining a laser sintering region; the PCB is positioned through the tool jig, and position information of a plurality of positioning points is obtained; laser sintering area distribution information is established according to the positioning point position information, and temperature information of a laser sintering area is collected; comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate; whether the temperature deviation rate is larger than or equal to a preset temperature threshold value or not is judged; if yes, adjusting information is generated, and the laser parameters of the laser sintering area are adjusted according to the adjusting information; if yes, sintering the laser sintering area according to the cur |
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