Circuit device
The invention discloses a circuit device. The circuit device comprises a circuit substrate, a protective layer and side wires, the circuit substrate has a first surface, a second surface opposite to the first surface, and a side surface. A first transition area is arranged between the first surface...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses a circuit device. The circuit device comprises a circuit substrate, a protective layer and side wires, the circuit substrate has a first surface, a second surface opposite to the first surface, and a side surface. A first transition area is arranged between the first surface and the side surface. A second transition area is arranged between the second surface and the side surface. The circuit substrate comprises a carrier plate and a first circuit structure. The first circuit structure is arranged on the carrier plate and comprises a connecting pad arranged on the first surface of the circuit substrate. The protective layer at least partially covers the first transition region and the second transition region. The material of the protective layer comprises cured silver paste, epoxy resin or an acryl insulating material. The side wires are located on the protective layer and extend to the second surface of the circuit substrate across the side surface of the circuit substrate from the c |
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