Product copper plating layer surface defect detection method and system

The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fittin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU ZHENG, LIU BO, LIU LETONG, CHEN WEICHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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