Product copper plating layer surface defect detection method and system

The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fittin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU ZHENG, LIU BO, LIU LETONG, CHEN WEICHANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface