Product copper plating layer surface defect detection method and system

The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fittin...

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Hauptverfasser: LIU ZHENG, LIU BO, LIU LETONG, CHEN WEICHANG
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Sprache:chi ; eng
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creator LIU ZHENG
LIU BO
LIU LETONG
CHEN WEICHANG
description The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface
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calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231103&amp;DB=EPODOC&amp;CC=CN&amp;NR=116990229A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231103&amp;DB=EPODOC&amp;CC=CN&amp;NR=116990229A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU ZHENG</creatorcontrib><creatorcontrib>LIU BO</creatorcontrib><creatorcontrib>LIU LETONG</creatorcontrib><creatorcontrib>CHEN WEICHANG</creatorcontrib><title>Product copper plating layer surface defect detection method and system</title><description>The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; 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language chi ; eng
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subjects CALCULATING
COMPUTING
COUNTING
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Product copper plating layer surface defect detection method and system
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