Product copper plating layer surface defect detection method and system
The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fittin...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LIU ZHENG LIU BO LIU LETONG CHEN WEICHANG |
description | The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116990229A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116990229A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116990229A3</originalsourceid><addsrcrecordid>eNrjZHAPKMpPKU0uUUjOLyhILVIoyEksycxLV8hJrATyikuL0hKTUxVSUtNSgWpSUkuAVGZ-nkJuaklGfopCYl6KQnFlcUlqLg8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uAJqSl1oS7-xnaGhmaWlgZGTpaEyMGgCNXTQ-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Product copper plating layer surface defect detection method and system</title><source>esp@cenet</source><creator>LIU ZHENG ; LIU BO ; LIU LETONG ; CHEN WEICHANG</creator><creatorcontrib>LIU ZHENG ; LIU BO ; LIU LETONG ; CHEN WEICHANG</creatorcontrib><description>The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231103&DB=EPODOC&CC=CN&NR=116990229A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231103&DB=EPODOC&CC=CN&NR=116990229A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU ZHENG</creatorcontrib><creatorcontrib>LIU BO</creatorcontrib><creatorcontrib>LIU LETONG</creatorcontrib><creatorcontrib>CHEN WEICHANG</creatorcontrib><title>Product copper plating layer surface defect detection method and system</title><description>The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPKMpPKU0uUUjOLyhILVIoyEksycxLV8hJrATyikuL0hKTUxVSUtNSgWpSUkuAVGZ-nkJuaklGfopCYl6KQnFlcUlqLg8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uAJqSl1oS7-xnaGhmaWlgZGTpaEyMGgCNXTQ-</recordid><startdate>20231103</startdate><enddate>20231103</enddate><creator>LIU ZHENG</creator><creator>LIU BO</creator><creator>LIU LETONG</creator><creator>CHEN WEICHANG</creator><scope>EVB</scope></search><sort><creationdate>20231103</creationdate><title>Product copper plating layer surface defect detection method and system</title><author>LIU ZHENG ; LIU BO ; LIU LETONG ; CHEN WEICHANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116990229A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU ZHENG</creatorcontrib><creatorcontrib>LIU BO</creatorcontrib><creatorcontrib>LIU LETONG</creatorcontrib><creatorcontrib>CHEN WEICHANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU ZHENG</au><au>LIU BO</au><au>LIU LETONG</au><au>CHEN WEICHANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Product copper plating layer surface defect detection method and system</title><date>2023-11-03</date><risdate>2023</risdate><abstract>The invention discloses a product copper plating layer surface defect detection method and system, and belongs to the field of defect detection.The method comprises the steps that a to-be-tested copper plating welding wire is fed, and a wire feeding resistance change curve is obtained through fitting; calculating a comprehensive curve change angle, and obtaining defect scale information; setting a surface defect detection operator according to the defect scale information; the method comprises the following steps: constructing an electrical test result array at a plurality of positions on the surface of a copper-plated welding wire, dividing the electrical test result array by adopting a detection operator to obtain a plurality of local arrays, and judging to obtain a plurality of defect local arrays and a plurality of defect positions; collecting images of a plurality of defect positions and carrying out graying processing to obtain a defect point set; and generating a defect detection result of the surface</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN116990229A |
source | esp@cenet |
subjects | CALCULATING COMPUTING COUNTING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING |
title | Product copper plating layer surface defect detection method and system |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T02%3A31%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU%20ZHENG&rft.date=2023-11-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116990229A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |