Semiconductor device

The semiconductor device includes: a semiconductor element; a first lead having a first portion on which the semiconductor element is mounted; a second lead that is spaced apart from the first lead and that is electrically connected to the semiconductor element; and a resin portion covering the semi...

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1. Verfasser: ONO TSUNEHISA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The semiconductor device includes: a semiconductor element; a first lead having a first portion on which the semiconductor element is mounted; a second lead that is spaced apart from the first lead and that is electrically connected to the semiconductor element; and a resin portion covering the semiconductor element and a portion of each of the first lead and the second lead. The first portion has a first main surface and a first back surface facing opposite to each other in the thickness direction. The semiconductor element has an element main surface and an element back surface facing opposite sides to each other in the thickness direction. The element back surface is opposite the first main surface. The resin portion has a resin main surface and a resin back surface facing opposite sides to each other in the thickness direction. The first back surface is exposed from the resin back surface, and the area ratio of the first back surface to the area of a region surrounded by the outer peripheral edge of the r