COPPER PARTICLES AND METHOD FOR MANUFACTURING SAME

The surface of core particles comprising metallic copper is coated with an organic protective film comprising organic molecules derived from copper carboxylate, the total concentration of metal impurities having a lower oxidation-reduction potential than copper contained in the particles is less than 10 ppm by mass, and the average particle diameter of the copper particles in the primary particle state is greater than 50 nm and 200 nm or less. When the copper particles are analyzed using time-of-flight secondary ion mass spectrometry (TOF-SIMS), the amount of detection of CuC2O2H-ions is in the range of 0.02 times or more with respect to the amount of detection of Cu + ions, and the amount of detection of C2H3O2-ions is in the range of 0.02 times or more with respect to the amount of detection of Cu + ions. 由金属铜构成的核粒子的表面被由源自羧酸铜的有机分子构成的有机保护膜包覆，粒子中所包含的氧化还原电位低于铜的金属杂质的合计浓度小于10质量ppm且铜粒子在一次粒子的状态下的平均粒径大于50nm且200nm以下。在使用飞行时间二次离子质谱分析法(TOF-SIMS)对铜粒子进行分析时，CuC2O2H-离子的检测量相对于Cu+离子的检测量在0.02倍以上的范围，C2H3O2-离子的检测量相对于Cu+离子的检测量在0