Preparation method for copper current collector with step-type structure for inducing lithium metal to grow inwards and application of copper current collector

The invention discloses a preparation method and application of a copper current collector with a step-type structure for inducing lithium metal to grow inwards. The invention belongs to the technical field of lithium ion batteries, and particularly relates to a preparation method and application of...

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Bibliographische Detailangaben
Hauptverfasser:	SONG JINPENG, YANG GUOBO, LU WEIHANG, LIU ZHEYUAN, LIU SHAOSHUAI, GENG LIN, ZHANG XIN, CONG GUANGHUI, HUANG YATING, HUANG LUJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses a preparation method and application of a copper current collector with a step-type structure for inducing lithium metal to grow inwards. The invention belongs to the technical field of lithium ion batteries, and particularly relates to a preparation method and application of a copper current collector with a step-type structure for inducing lithium metal to grow inwards. The invention aims to solve the problems that in an existing structure modification method, most template materials cannot be repeatedly used, template synthesis is too complex, large-scale commercialization and environment friendliness are not facilitated, and in addition, a prepared current collector cannot effectively relieve the volume expansion phenomenon in the lithium metal growth process. The method comprises the following steps: by adopting a laser etching technology and a low-power multi-bombardment processing method, while preparing a distributed micro-pit array, introducing a layered nano-structure into th