LED chip and manufacturing method thereof
The invention provides an LED chip and a manufacturing method thereof, the LED chip comprises a metal bonding layer, a metal reflection structure, a transparent medium structure and a stacking structure, the metal reflection structure and the transparent medium structure form an ODR reflection struc...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an LED chip and a manufacturing method thereof, the LED chip comprises a metal bonding layer, a metal reflection structure, a transparent medium structure and a stacking structure, the metal reflection structure and the transparent medium structure form an ODR reflection structure, and the ODR reflection structure is used for reflecting light emitted by an active area and preventing metal materials from migrating to the active area; the metal reflection structure is a multi-layer composite reflection structure, so that the reflectivity can be effectively improved; the transparent medium structure comprises a dielectric layer or an insulating medium layer, the insulating medium layer is provided with a plurality of through holes penetrating through the insulating medium layer, each through hole is filled with a metal material to form a plurality of conductive channels, current can be uniformly distributed through the dielectric layer or the conductive channels, and the phenomenon that un |
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