Chip film pouring method

The invention provides a chip film pouring method, which comprises the following steps: pouring a chip from an initial blue film to a UV film, and carrying out wafer expansion treatment on the UV film with the chip to reduce the viscous force influence of the point contact area of the chip; carrying out peptizing treatment on the UV film after wafer expansion so as to enable the chip to be more easily grabbed from the UV film; and rearranging the chips on the UV film subjected to peptizing treatment onto the target blue film to complete film inversion of the chips, so that the problem of film inversion failure of the chips is effectively solved, and the production yield and efficiency are improved. 本发明提供一种芯片倒膜方法，通过将芯片由初始蓝膜上倒膜至UV膜上，并将带有芯片的UV膜进行扩晶处理，以减小芯片的点接触面积粘力影响；将扩晶后的UV膜进行解胶处理，以使芯片更容易从UV膜上抓取；将解胶处理后的UV膜上的芯片重排至目标蓝膜上，以完成芯片的倒膜，有效解决芯片倒膜失败的问题，从而提高了生产良率和效率。