Tool clamp for chip bonding of integrated circuit

The invention provides a tool clamp for chip bonding of an integrated circuit, which comprises a bottom plate (1), a group of tube shell placing units (2) arranged on the bottom plate (1), a cover plate (4) covering all the tube shell placing units (2), and a group of magnets (3) correspondingly matched with the cover plate (4) arranged on the bottom plate (1). The device has the advantages of being simple in structure and convenient to use, is suitable for automatic die bonding, does not displace in the dispensing and die bonding processes, and ensures that a device does not displace in the die bonding process, so that the problems of low manual die bonding efficiency and low yield of a small-size circuit are solved. 本发明提供一种用于集成电路的粘片用工装夹具，它包括底板（1），在底板（1）上设有一组管壳放置单元（2），设置一个覆盖所有管壳放置单元（2）的盖板（4），在底板（1）上还设有一组与盖板（4）对应配合磁铁（3）。本发明具有结构简单，使用方便的优点，适用于自动化粘片，在点胶和粘片过程中不发生位移，保证器件在粘片过程中不出现任何位移，从而解决小尺寸电路的手工粘片效率低、良率低的难题。