Chip packaging equipment equipped with packaging mechanism and use method thereof
The invention discloses chip packaging equipment equipped with a packaging mechanism and a using method thereof.The chip packaging equipment comprises a first discharging hopper, a second discharging hopper is fixedly connected to one side of the first discharging hopper, vibration mechanisms are in...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses chip packaging equipment equipped with a packaging mechanism and a using method thereof.The chip packaging equipment comprises a first discharging hopper, a second discharging hopper is fixedly connected to one side of the first discharging hopper, vibration mechanisms are installed on the surfaces of the first discharging hopper and the second discharging hopper, a first discharging plate is hinged to the interior of the first discharging hopper, and a second discharging plate is hinged to the interior of the second discharging hopper. A first discharging plate is hinged to the interior of the first discharging hopper, a second discharging plate is hinged to the interior of the second discharging hopper, the first discharging hopper and the second discharging hopper are connected with the first discharging plate and the second discharging plate through locking mechanisms, and grooves are evenly formed in the top face of the first discharging plate and the top face of the second discha |
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