Packaging method for batch plastic packaging of ceramic substrates

The invention discloses a packaging method for batch plastic packaging of ceramic substrates, which comprises the following steps: by utilizing the advantage of low cost of an organic substrate, punching a plurality of through holes in the organic substrate to reserve a mounting position of the ceramic substrate, bonding the organic substrate and the ceramic substrate together by using temporary bonding glue to ensure that the lower surface is a plane, and then performing surface mounting and bonding on the ceramic substrate, so as to obtain the batch plastic packaging of the ceramic substrates. And finally, cutting to form a plurality of independent devices with the same or different functions. The system has the advantages of being suitable for research and development of multi-variety and small-batch products, high in automation degree, high in heat dissipation requirement, low in cost and the like, and important technical support can be provided for subsequent miniaturization development of a three-dimens