Diamond-based gallium nitride transistor preparation method and diamond-based gallium nitride transistor

The invention is suitable for the technical field of semiconductor devices, and provides a diamond-based gallium nitride transistor preparation method and a diamond-based gallium nitride transistor, and the method comprises the steps: preparing an electrode field plate region on the upper surface of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CUI YUXING, ZHOU GUO, LIAO LONGZHONG, QIN LONG, SONG HONGWEI, ZHANG LIJIANG, FU XINGZHONG, WU YICHANG, SONG JIEJING, FENG LIDONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CUI YUXING
ZHOU GUO
LIAO LONGZHONG
QIN LONG
SONG HONGWEI
ZHANG LIJIANG
FU XINGZHONG
WU YICHANG
SONG JIEJING
FENG LIDONG
description The invention is suitable for the technical field of semiconductor devices, and provides a diamond-based gallium nitride transistor preparation method and a diamond-based gallium nitride transistor, and the method comprises the steps: preparing an electrode field plate region on the upper surface of a silicon-based gallium nitride wafer; sputtering a first metal layer on the upper surface of the silicon-based gallium nitride wafer and the upper surface of the silicon wafer, and performing pre-bonding; carrying out temporary bonding on the carrier and the silicon wafer; removing a silicon substrate of the silicon-based gallium nitride wafer to obtain a gallium nitride epitaxial layer supported by the silicon wafer, and sputtering a second metal layer or depositing a dielectric layer on the lower surface of the gallium nitride epitaxial layer and the upper surface of the diamond for bonding; removing the carrier, the silicon wafer and the first metal layer to obtain a diamond-based gallium nitride wafer; and pe
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116978786A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116978786A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116978786A3</originalsourceid><addsrcrecordid>eNqNyzEOwjAMQNEsDAi4gzlAhwqpLSMqICYm9spgQy0ldpSY-7NwgE5_eX8d5rNgMqXmiZUJPhijfBOoeBFi8IJapboVyIUzFnQxhcQ-GwEqAS38t2H1xlh59-8m7K-Xx3hrONvENeOLlX0a723bHfuhH7rTYYn5AXiaQWg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Diamond-based gallium nitride transistor preparation method and diamond-based gallium nitride transistor</title><source>esp@cenet</source><creator>CUI YUXING ; ZHOU GUO ; LIAO LONGZHONG ; QIN LONG ; SONG HONGWEI ; ZHANG LIJIANG ; FU XINGZHONG ; WU YICHANG ; SONG JIEJING ; FENG LIDONG</creator><creatorcontrib>CUI YUXING ; ZHOU GUO ; LIAO LONGZHONG ; QIN LONG ; SONG HONGWEI ; ZHANG LIJIANG ; FU XINGZHONG ; WU YICHANG ; SONG JIEJING ; FENG LIDONG</creatorcontrib><description>The invention is suitable for the technical field of semiconductor devices, and provides a diamond-based gallium nitride transistor preparation method and a diamond-based gallium nitride transistor, and the method comprises the steps: preparing an electrode field plate region on the upper surface of a silicon-based gallium nitride wafer; sputtering a first metal layer on the upper surface of the silicon-based gallium nitride wafer and the upper surface of the silicon wafer, and performing pre-bonding; carrying out temporary bonding on the carrier and the silicon wafer; removing a silicon substrate of the silicon-based gallium nitride wafer to obtain a gallium nitride epitaxial layer supported by the silicon wafer, and sputtering a second metal layer or depositing a dielectric layer on the lower surface of the gallium nitride epitaxial layer and the upper surface of the diamond for bonding; removing the carrier, the silicon wafer and the first metal layer to obtain a diamond-based gallium nitride wafer; and pe</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231031&amp;DB=EPODOC&amp;CC=CN&amp;NR=116978786A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231031&amp;DB=EPODOC&amp;CC=CN&amp;NR=116978786A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CUI YUXING</creatorcontrib><creatorcontrib>ZHOU GUO</creatorcontrib><creatorcontrib>LIAO LONGZHONG</creatorcontrib><creatorcontrib>QIN LONG</creatorcontrib><creatorcontrib>SONG HONGWEI</creatorcontrib><creatorcontrib>ZHANG LIJIANG</creatorcontrib><creatorcontrib>FU XINGZHONG</creatorcontrib><creatorcontrib>WU YICHANG</creatorcontrib><creatorcontrib>SONG JIEJING</creatorcontrib><creatorcontrib>FENG LIDONG</creatorcontrib><title>Diamond-based gallium nitride transistor preparation method and diamond-based gallium nitride transistor</title><description>The invention is suitable for the technical field of semiconductor devices, and provides a diamond-based gallium nitride transistor preparation method and a diamond-based gallium nitride transistor, and the method comprises the steps: preparing an electrode field plate region on the upper surface of a silicon-based gallium nitride wafer; sputtering a first metal layer on the upper surface of the silicon-based gallium nitride wafer and the upper surface of the silicon wafer, and performing pre-bonding; carrying out temporary bonding on the carrier and the silicon wafer; removing a silicon substrate of the silicon-based gallium nitride wafer to obtain a gallium nitride epitaxial layer supported by the silicon wafer, and sputtering a second metal layer or depositing a dielectric layer on the lower surface of the gallium nitride epitaxial layer and the upper surface of the diamond for bonding; removing the carrier, the silicon wafer and the first metal layer to obtain a diamond-based gallium nitride wafer; and pe</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzEOwjAMQNEsDAi4gzlAhwqpLSMqICYm9spgQy0ldpSY-7NwgE5_eX8d5rNgMqXmiZUJPhijfBOoeBFi8IJapboVyIUzFnQxhcQ-GwEqAS38t2H1xlh59-8m7K-Xx3hrONvENeOLlX0a723bHfuhH7rTYYn5AXiaQWg</recordid><startdate>20231031</startdate><enddate>20231031</enddate><creator>CUI YUXING</creator><creator>ZHOU GUO</creator><creator>LIAO LONGZHONG</creator><creator>QIN LONG</creator><creator>SONG HONGWEI</creator><creator>ZHANG LIJIANG</creator><creator>FU XINGZHONG</creator><creator>WU YICHANG</creator><creator>SONG JIEJING</creator><creator>FENG LIDONG</creator><scope>EVB</scope></search><sort><creationdate>20231031</creationdate><title>Diamond-based gallium nitride transistor preparation method and diamond-based gallium nitride transistor</title><author>CUI YUXING ; ZHOU GUO ; LIAO LONGZHONG ; QIN LONG ; SONG HONGWEI ; ZHANG LIJIANG ; FU XINGZHONG ; WU YICHANG ; SONG JIEJING ; FENG LIDONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116978786A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CUI YUXING</creatorcontrib><creatorcontrib>ZHOU GUO</creatorcontrib><creatorcontrib>LIAO LONGZHONG</creatorcontrib><creatorcontrib>QIN LONG</creatorcontrib><creatorcontrib>SONG HONGWEI</creatorcontrib><creatorcontrib>ZHANG LIJIANG</creatorcontrib><creatorcontrib>FU XINGZHONG</creatorcontrib><creatorcontrib>WU YICHANG</creatorcontrib><creatorcontrib>SONG JIEJING</creatorcontrib><creatorcontrib>FENG LIDONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CUI YUXING</au><au>ZHOU GUO</au><au>LIAO LONGZHONG</au><au>QIN LONG</au><au>SONG HONGWEI</au><au>ZHANG LIJIANG</au><au>FU XINGZHONG</au><au>WU YICHANG</au><au>SONG JIEJING</au><au>FENG LIDONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Diamond-based gallium nitride transistor preparation method and diamond-based gallium nitride transistor</title><date>2023-10-31</date><risdate>2023</risdate><abstract>The invention is suitable for the technical field of semiconductor devices, and provides a diamond-based gallium nitride transistor preparation method and a diamond-based gallium nitride transistor, and the method comprises the steps: preparing an electrode field plate region on the upper surface of a silicon-based gallium nitride wafer; sputtering a first metal layer on the upper surface of the silicon-based gallium nitride wafer and the upper surface of the silicon wafer, and performing pre-bonding; carrying out temporary bonding on the carrier and the silicon wafer; removing a silicon substrate of the silicon-based gallium nitride wafer to obtain a gallium nitride epitaxial layer supported by the silicon wafer, and sputtering a second metal layer or depositing a dielectric layer on the lower surface of the gallium nitride epitaxial layer and the upper surface of the diamond for bonding; removing the carrier, the silicon wafer and the first metal layer to obtain a diamond-based gallium nitride wafer; and pe</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN116978786A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Diamond-based gallium nitride transistor preparation method and diamond-based gallium nitride transistor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T15%3A43%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CUI%20YUXING&rft.date=2023-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116978786A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true