Manufacturing method of circuit board

The invention discloses a manufacturing method of a circuit board, and the method comprises the steps: providing a core board, patterning the core board, and forming a first circuit layer at the outer side of the core board; forming a first insulating layer in the gap of the first circuit layer; and arranging a second insulating layer on the first insulating layer and the first circuit layer. Through the above mode, the manufacturing method of the circuit board can effectively perform stable high-precision control on the thickness of the first insulating layer and the second insulating layer, greatly improves the thickness uniformity of the first insulating layer and the second insulating layer, and further can greatly improve the stability of high-precision impedance control. 本申请公开了一种电路板的制造方法，其中，该提供芯板，图案化芯板，以在芯板的外侧形成第一线路层；在第一线路层的间隙中形成第一绝缘层；在第一绝缘层和第一线路层上设置第二绝缘层。通过上述方式，本申请中的电路板的制造方法能够有效对第一绝缘层和第二绝缘层的厚度进行稳定的高精度控制，而大幅提升第一绝缘层和第二绝缘层厚度的均匀性，进而能够大幅提升高精度阻抗控制的稳定性。