Packaging process for optical dual-mold-pressing module with ITO shielding layer

The invention discloses a packaging technology for an optical dual-mold-pressing module with an ITO shielding layer. The packaging technology for the optical dual-mold-pressing module with the ITO shielding layer is a sensor dual-mold-pressing module packaging technology which is higher in product i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YU QICHUAN, WANG JI, ZHANG YONGQING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES USING STIMULATED EMISSION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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