Packaging process for optical dual-mold-pressing module with ITO shielding layer

The invention discloses a packaging technology for an optical dual-mold-pressing module with an ITO shielding layer. The packaging technology for the optical dual-mold-pressing module with the ITO shielding layer is a sensor dual-mold-pressing module packaging technology which is higher in product integration degree, smaller in packaging size and good in warping control. According to the invention, the ITO anti-electromagnetic interference layer is connected with the PCB and integrated in the packaging material, and the packaging layer of the product occupies a small space, so that the product is small in design size and thin; from the perspective of safety, if the sensor packaged by the structure finds an abnormal phenomenon in the use process of a product, because the ITO layer is connected with a grounding lead of the bottom PCB layer, a system can be automatically powered off, a module emission light source is cut off, and the safety of a user is protected; a wafer level optical packaging mode is adopted,