Chip packaging structure and method

The invention discloses a chip packaging structure and method, and belongs to the technical field of chip packaging, the chip packaging structure comprises a first packaging body, a second packaging body and a plurality of solder balls, and the first packaging body and the second packaging body are connected through the solder balls; the first packaging body comprises at least one surface mounting device and at least one bare chip, and the at least one surface mounting device and the at least one bare chip are connected through a rewiring layer and a through hole; the second packaging body comprises at least one surface mounting device and at least one bare chip, and the at least one surface mounting device and the at least one bare chip are connected through a rewiring layer and a through hole. According to the chip packaging structure and method, more devices can be integrated in the packaging body, the overall dimension of a final product is reduced, and the integration level is improved. 本发明公开了一种芯片封装结构及方法