Chip and electronic equipment

The invention provides a chip, an electronic device, a substrate and a device layer, the substrate comprises a supporting layer and a heat dissipation layer, and the supporting layer and the heat dissipation layer are connected in a stacked mode in the thickness direction of the chip; the device layer is laminated on the surface of the support layer deviating from the heat dissipation layer; the heat dissipation layer comprises a heat dissipation part and a spacing part, and the heat dissipation part and the spacing part are arranged and connected in the direction perpendicular to the thickness direction of the chip; the heat dissipation part is provided with a plurality of first heat dissipation gaps, and the plurality of first heat dissipation gaps penetrate through the surface, deviating from the supporting layer, of the heat dissipation part; and a first heat dissipation fin is arranged between any two adjacent first heat dissipation gaps. The first heat dissipation fins and the first heat dissipation gap