Method for forming guide connection circuit of semiconductor chip package with circuit defined by photoresist

The invention discloses a method for forming a conducting circuit of a semiconductor chip package with a photoresist defined circuit. The method comprises the following steps of: coating a first dielectric layer on the surface of a welding pad of a semiconductor chip; forming a first groove on the first dielectric substance layer by using a photoresist, filling the first groove with a conductive metal substance, then printing silver paste by using a silk screen plate, and coating photoresist on the silver paste; forming a photoresist definition circuit on the photoresist by using a photomask in an exposure and development mode; performing dry etching to remove the conductive metal on the first dielectric substance layer outside the photoresist definition circuit to form a first conductive connection circuit and a second conductive connection circuit, stripping the photoresist definition circuit, wrapping the surface of the photoresist definition circuit with the conductive metal to form a third conductive con