Coarse grinding fluid for processing silicon carbide wafer and preparation method thereof

The invention relates to coarse grinding liquid for processing a silicon carbide wafer and a preparation method of the coarse grinding liquid. The coarse grinding liquid comprises a solution A and a solution B, the solution A comprises the following raw materials in percentage by mass: 5-15% of aluminum oxide; 0.1-5% of a dispersant; 0.5-10% of an oxidizing agent; 0.001-1% of a bactericide; and the balance of water. The solution B is prepared from the following raw materials in percentage by mass: 0.1 to 5 percent of accelerant; 0.001-1% of a bactericide; and the balance of water. The preparation method comprises the following steps: firstly preparing a solution A and a solution B, and then mixing the solution A and the solution B to obtain the coarse grinding liquid. The rough grinding fluid provided by the invention is high in removal rate and good in surface polishing effect, and can be recycled. 本发明涉及一种用于碳化硅晶片加工的粗磨液及其制备方法，所述粗磨液包括溶液A和溶液B；以质量百分含量计，所述溶液A包括以下原料：氧化铝5-15％；分散剂0.1-5％；氧化剂0.5-10％；杀菌剂0.001-1％；余量为水；以