Jig and laser cutting device comprising same
The invention discloses a jig and a laser cutting device comprising the jig. The jig according to an embodiment of the present invention is configured to support an electrode that is conveyed in a first direction and includes a coated portion coated with an electrode active material and an uncoated...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a jig and a laser cutting device comprising the jig. The jig according to an embodiment of the present invention is configured to support an electrode that is conveyed in a first direction and includes a coated portion coated with an electrode active material and an uncoated portion not coated with the electrode active material, and includes: a first support portion configured to support a region corresponding to the uncoated portion in the electrode, and a second support portion configured to support a region corresponding to the uncoated portion in the electrode; the laser cutting device is provided with a laser containing part which is formed at a position corresponding to a region irradiated with laser light for cutting the uncoated part. And a second support part configured to support a region of the electrode corresponding to the coated part.
治具及包括该治具的激光切割装置。根据本发明一实施例的治具构成为支承沿第一方向输送并且包括涂有电极活性物质的有涂层部以及未涂覆上述电极活性物质的无涂层部的电极,治具包括:第一支承部,其构成为支承上述电极中对应于上述无涂层部的区域,并且具备激光收容部,上述激光收容部形成在与照射有用 |
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