Lead frame and manufacturing method thereof

Lead frame and manufacturing method thereof

**The lead frame (100) is provided with a plurality of lead parts (110), at least a part of the upper surface of each lead part (110) and the side wall surface of each lead part (110) are roughened rough surfaces, and the a * value of the rough surfaces in the CIELab color space is in the range of 1...

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Bibliographische Detailangaben
Hauptverfasser: NAGATA MASAHIRO, HATSUTA CHIAKI, YAMADA MASAHIRO, MATSUI HIDETO, SEKI, KENTAROU, OUCHI KAZUNORI, SHINOZAKI KAZUHIRO, OKUYAMA DAISUKE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:**The lead frame (100) is provided with a plurality of lead parts (110), at least a part of the upper surface of each lead part (110) and the side wall surface of each lead part (110) are roughened rough surfaces, and the a * value of the rough surfaces in the CIELab color space is in the range of 12-19, and the b * value of the rough surfaces in the CIELab color space is in the range of 12-17. 引线框(100)具备多个引线部(110)，引线部(110)的上表面的至少一部分和引线部(110)的侧壁面是被粗糙化的粗糙面，粗糙面在CIELab颜色空间中的a*值为12～19的范围，b*值为12～17的范围。