Circuit board silver removing method, circuit board silver removing device and circuit board

The invention relates to the field of printed circuit boards, and discloses a circuit board silver removing method, a circuit board silver removing device and a circuit board. The circuit board silver removing method comprises the steps that the circuit board is provided, and the circuit board is provided with first to-be-removed silver; and a first spraying assembly is used for spraying silver removing liquid medicine to the first to-be-removed silver so as to remove the first to-be-removed silver. According to the circuit board silver removing method provided by the invention, the silver removing effect of the circuit board can be improved. 本申请涉及印制线路板领域，公开了一种线路板退银方法、线路板退银装置及线路板，线路板退银方法包括：提供线路板，所述线路板设有第一待退银；使用第一喷淋组件向所述第一待退银喷淋退银药液，以除去所述第一待退银。本申请提供的线路板退银方法，能够提高线路板的退银效果。