Manufacturing method of FPC (Flexible Printed Circuit) product capable of directly punching circuit and appearance, and single-sided circuit board

The invention belongs to the technical field of single-layer flexible circuit board manufacturing, and discloses an FPC product manufacturing method capable of directly punching lines and shapes and a single-face circuit board. The method comprises the following steps of: punching a copper foil into a circuit, stripping waste copper foil of an outer frame, and reserving an effective copper foil circuit on a second material carrying film belt; performing pattern punching and windowing on the lower cover film, and then combining and pre-pasting with a copper foil circuit; the upper cover film is subjected to pattern punching and windowing, and then the upper cover film, the lower cover film and the copper foil circuit are aligned, combined and pre-pasted; and the appearance of the product is punched and formed through the appearance punching die, and the single-sided circuit board is manufactured through punching. The conventional production of the prepared product is completed on one machine, and the product i