Grooving method without exposing copper and packaging circuit board

The invention discloses a copper-exposure-free grooving method and a packaged circuit board, and the method comprises the steps: providing a circuit board with a through hole in the surface, and carrying out the copper-avoiding processing of a preset region of the circuit board; performing back drilling treatment on the via hole in the preset area by using a back drilling process to obtain a back drilling hole with a first depth; performing resin hole plugging on the back drilling hole and the via hole; performing groove milling on a preset area of the circuit board after the resin hole plugging to obtain a groove with a second depth; wherein the second depth is smaller than the first depth. According to the method, the groove without copper exposure is obtained, so that the reliability of embedding the electronic component into the groove is improved. 本申请公开了一种不露铜的开槽方法及封装电路板，其中，不露铜的开槽方法包括：提供一种表面设置有过孔的电路板，其中，所述电路板的预设区域作避铜处理；利用背钻工艺对预设区域的所述过孔进行背钻处理，以得到第一深度的背钻孔；对所述背钻孔和所述过孔进行树脂塞孔；在树脂塞孔后的所述电路板的预设区域进行铣槽，以得到第二深度的凹槽；其