Power module

A power module is provided with: a substrate; a SiC semiconductor element electrically connected to a conductor provided on the substrate; and a flexible printed circuit board connected to the SiC semiconductor element, the flexible printed circuit board having a conductor layer electrically connected to the SiC semiconductor element, the conductor layer having a thickness of 70 [mu] m or more and 500 [mu] m or less. 一种功率模块，所述功率模块具备：基板；与设置在所述基板上的导体电连接的SiC半导体元件；以及与所述SiC半导体元件连接的柔性印刷电路板，所述柔性印刷电路板具有与所述SiC半导体元件电连接的导体层，所述导体层的厚度为70μm以上500μm以下。