Low-temperature curing conductive silver paste and preparation method and application thereof

The invention provides low-temperature curing conductive silver paste and a preparation method and application thereof, and belongs to the technical field of conductive paste. The low-temperature curing conductive silver paste comprises the following components in parts by mass: 75-80 parts of silve...

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Hauptverfasser: XU CAIYU, HU JIAYAN, HU YINPING
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides low-temperature curing conductive silver paste and a preparation method and application thereof, and belongs to the technical field of conductive paste. The low-temperature curing conductive silver paste comprises the following components in parts by mass: 75-80 parts of silver powder; 10-15 parts by mass of an organic solvent; 0.2 to 0.5 part by mass of a dispersant; 0.2 to 1.0 part by mass of a curing agent; 8-15 parts by mass of mixed organic resin, wherein the mixed organic resin comprises saturated polyester resin; and 0.02-0.1 part by mass of an initiator, wherein the initiator is an azo initiator. And initiating the saturated polyester resin to generate a cross-linking reaction through an azo initiator to complete low-temperature curing of the paste, so that when the conductive silver paste formed by the formula is used for a metal grid flexible transparent film, the thermocuring temperature in the existing process is reduced from 130 DEG C to 90 DEG C, and the thermocuring time