Method for predicting hot cracks in solidification process of binary alloy material
The invention discloses a method for predicting hot cracks in a binary alloy material solidification process, which comprises the following steps of: firstly, obtaining relevant thermal parameters of the solidification process through a thermal-mechanical coupling finite element simulation result, s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for predicting hot cracks in a binary alloy material solidification process, which comprises the following steps of: firstly, obtaining relevant thermal parameters of the solidification process through a thermal-mechanical coupling finite element simulation result, such as a temperature gradient, a temperature field advancing speed, a strain rate and the like; secondly, tissue evolution information under the corresponding solidification condition is obtained through solidification process phase field simulation, and dendritic crystal spacing and a solidification path are extracted from the tissue evolution information, namely, the change relation of the solid phase volume fraction along with a temperature field; secondly, inputting thermal parameters obtained by finite element simulation and structure evolution information obtained by phase field simulation into a two-phase RDG model for hot crack sensitivity calculation, and calculating to obtain a drop value of liquid phase |
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