Preparation method of nano silicon carbide abrasive
The invention discloses a preparation method of a nano silicon carbide abrasive material, which comprises the following steps: preparing silicon carbide nano particles through carbon thermal reduction by taking biomass carbon as a carbon source, tetraethoxysilane as a silicon source and ferric nitra...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a preparation method of a nano silicon carbide abrasive material, which comprises the following steps: preparing silicon carbide nano particles through carbon thermal reduction by taking biomass carbon as a carbon source, tetraethoxysilane as a silicon source and ferric nitrate as a catalyst, pickling the silicon carbide nano particles, and tempering at 1000-1200 DEG C to obtain the nano silicon carbide abrasive material, the biomass carbon is obtained by carrying out high-temperature carbonization on a dry biomass raw material. The prepared nano silicon carbide abrasive material is good in grinding performance, capable of achieving a high polishing rate and suitable for a semiconductor mechanical grinding and polishing process, and the preparation process is low in energy consumption and low in cost.
本发明公开了一种纳米碳化硅磨料的制备方法,包括以生物质碳为碳源,正硅酸乙酯为硅源,硝酸铁为催化剂,通过碳热还原制备出碳化硅纳米颗粒,对所述碳化硅纳米颗粒进行酸洗并在1000~1200℃下回火制得所述纳米碳化硅磨料,所述生物质碳是由干燥的生物质原料经过高温碳化得到。本发明制得的纳米碳化硅磨料磨削性能好,可达到较高的抛光速率,适用于半导体机械研磨抛光工艺,制备过程能耗低,成本 |
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