Cutting method for reducing chromatic aberration caused by wire welding after wire breakage of crystal silicon slice

The invention discloses a cutting method for reducing chromatic aberration caused by wire welding after wire breakage of a crystal silicon slice, which specifically comprises the following steps: S1, welding a welding spot by using a spot welding machine after wire breakage, hoisting at the welding...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GE LINGJIE, SUN SHOUZHEN, SHAO XUEFENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a cutting method for reducing chromatic aberration caused by wire welding after wire breakage of a crystal silicon slice, which specifically comprises the following steps: S1, welding a welding spot by using a spot welding machine after wire breakage, hoisting at the welding spot after welding, and testing the quality of the welding spot by using a 500g weight; s2, welding spots are collected into a wire net, cutting is directly conducted after the cutting technology is changed, and the cutting technology changing method specifically comprises wire inlet method changing and machine speed and wire speed method changing; s3, the distance between the welding spot and the wire wheel is measured, the total wire inlet length is calculated, and the take-up tension is reduced to 1.5 N before the welding spot enters the wire wheel by 500 m; and S4, after the welding spot enters the wire wheel, normal startup is carried out by using the original process. The invention relates to the technical fi