Polishing pad, method of manufacturing polishing pad, and polishing apparatus

The invention provides a grinding pad, a method for manufacturing the grinding pad and a grinding device. The polishing pad comprises a polishing layer having a plurality of foaming holes, and the diameter of each foaming hole is 1 [mu] m to 10 [mu] m. The invention also provides a manufacturing method of the polishing pad. The manufacturing method comprises the following steps: (a) providing the substrate layer; (b) foaming resin is formed on the base layer, the foaming resin comprises a grinding layer and a fluff layer, the grinding layer is provided with a plurality of foaming holes, and the diameter of each foaming hole ranges from 1 micrometer to 10 micrometers; and (c) removing the fluff layer. When the grinding pad is adopted for the grinding process, residues such as impurities or agglomerated grinding particles generated in the grinding process are not prone to being blocked in the holes, and the surface of the base material to be ground is prevented from being scratched. 本发明提供了一种研磨垫及制造研磨垫的方法与研磨装置。该研