Semiconductor device

A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a pluralit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIA ZHAOWEI, WANG JIAN, LU CHENHUA, YANG HONGCHAO, WANG HUI, DIAO JIANHUA
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator JIA ZHAOWEI
WANG JIAN
LU CHENHUA
YANG HONGCHAO
WANG HUI
DIAO JIANHUA
description A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a plurality of branch pipelines, and the plurality of branch pipelines comprise a first pipeline and a second pipeline. The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116921095A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116921095A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116921095A3</originalsourceid><addsrcrecordid>eNrjZBAJTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZpZGhgaWpo7GxKgBAF4vIO4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor device</title><source>esp@cenet</source><creator>JIA ZHAOWEI ; WANG JIAN ; LU CHENHUA ; YANG HONGCHAO ; WANG HUI ; DIAO JIANHUA</creator><creatorcontrib>JIA ZHAOWEI ; WANG JIAN ; LU CHENHUA ; YANG HONGCHAO ; WANG HUI ; DIAO JIANHUA</creatorcontrib><description>A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a plurality of branch pipelines, and the plurality of branch pipelines comprise a first pipeline and a second pipeline. The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; NOZZLES ; PERFORMING OPERATIONS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231024&amp;DB=EPODOC&amp;CC=CN&amp;NR=116921095A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231024&amp;DB=EPODOC&amp;CC=CN&amp;NR=116921095A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIA ZHAOWEI</creatorcontrib><creatorcontrib>WANG JIAN</creatorcontrib><creatorcontrib>LU CHENHUA</creatorcontrib><creatorcontrib>YANG HONGCHAO</creatorcontrib><creatorcontrib>WANG HUI</creatorcontrib><creatorcontrib>DIAO JIANHUA</creatorcontrib><title>Semiconductor device</title><description>A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a plurality of branch pipelines, and the plurality of branch pipelines comprise a first pipeline and a second pipeline. The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese</description><subject>APPARATUS THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZpZGhgaWpo7GxKgBAF4vIO4</recordid><startdate>20231024</startdate><enddate>20231024</enddate><creator>JIA ZHAOWEI</creator><creator>WANG JIAN</creator><creator>LU CHENHUA</creator><creator>YANG HONGCHAO</creator><creator>WANG HUI</creator><creator>DIAO JIANHUA</creator><scope>EVB</scope></search><sort><creationdate>20231024</creationdate><title>Semiconductor device</title><author>JIA ZHAOWEI ; WANG JIAN ; LU CHENHUA ; YANG HONGCHAO ; WANG HUI ; DIAO JIANHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116921095A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JIA ZHAOWEI</creatorcontrib><creatorcontrib>WANG JIAN</creatorcontrib><creatorcontrib>LU CHENHUA</creatorcontrib><creatorcontrib>YANG HONGCHAO</creatorcontrib><creatorcontrib>WANG HUI</creatorcontrib><creatorcontrib>DIAO JIANHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIA ZHAOWEI</au><au>WANG JIAN</au><au>LU CHENHUA</au><au>YANG HONGCHAO</au><au>WANG HUI</au><au>DIAO JIANHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device</title><date>2023-10-24</date><risdate>2023</risdate><abstract>A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a plurality of branch pipelines, and the plurality of branch pipelines comprise a first pipeline and a second pipeline. The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN116921095A
source esp@cenet
subjects APPARATUS THEREFOR
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
NOZZLES
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title Semiconductor device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T07%3A04%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIA%20ZHAOWEI&rft.date=2023-10-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116921095A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true