Semiconductor device
A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a pluralit...
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creator | JIA ZHAOWEI WANG JIAN LU CHENHUA YANG HONGCHAO WANG HUI DIAO JIANHUA |
description | A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a plurality of branch pipelines, and the plurality of branch pipelines comprise a first pipeline and a second pipeline. The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese |
format | Patent |
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The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; NOZZLES ; PERFORMING OPERATIONS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231024&DB=EPODOC&CC=CN&NR=116921095A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231024&DB=EPODOC&CC=CN&NR=116921095A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIA ZHAOWEI</creatorcontrib><creatorcontrib>WANG JIAN</creatorcontrib><creatorcontrib>LU CHENHUA</creatorcontrib><creatorcontrib>YANG HONGCHAO</creatorcontrib><creatorcontrib>WANG HUI</creatorcontrib><creatorcontrib>DIAO JIANHUA</creatorcontrib><title>Semiconductor device</title><description>A semiconductor device disclosed by the present invention comprises a spraying device and a plurality of working cavities, the spraying device comprises a liquid supply pipeline, a supercharging device and a pressure control device, the liquid supply pipeline comprises a main pipeline and a plurality of branch pipelines, and the plurality of branch pipelines comprise a first pipeline and a second pipeline. 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The main pipeline is connected with the first end of the first pipeline and the first end of the second pipeline; the pressurizing device is arranged on the main pipeline, the pressurizing device pressurizes the spraying liquid introduced into the main pipeline according to a first preset pressure value, the pressurized spraying liquid enters the first pipeline and the second pipeline, and the spraying liquid at the second end of the first pipeline has the first preset pressure value; the pressure control device adjusts the pressure of the spraying liquid in the second pipeline according to the second prese</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY NOZZLES PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | Semiconductor device |
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