Electronic device with crack arrest structure

A packaged electronic device (100) includes a multi-layer lead frame (101) having a first trace level and a second trace level, a via level, an insulator, a conductive contact pad (108, 112) having a linear profile extending along a side (105) of the multi-layer lead frame (101) in a first direction, and a conductive crack arrest structure (114, 115) having a linear profile extending along a side (105) of the multi-layer lead frame (101) in a second direction, the conductive crack arrest structure (114, 115) has a linear profile along a first direction, and the conductive crack arrest structure (114, 115) is spaced apart from the conductive contact pad (108, 112) along an orthogonal second direction. 一种封装电子器件(100)，包括多层引线框架(101)，该多层引线框架具有第一迹线层级和第二迹线层级、过孔层级、绝缘体、导电触点焊盘(108、112)、以及导电止裂结构(114、115)，导电触点焊盘(108、112)具有沿第一方向沿多层引线框架(101)的一侧(105)延伸的直线轮廓，导电止裂结构(114、115)具有沿第一方向的直线轮廓，并且导电止裂结构(114、115)沿正交的第二方向与导电触点焊盘(108、112)间隔开。