Ceramic interconnection device based on HTCC

The invention discloses a ceramic interconnection device based on HTCC, and relates to the technical field of radio frequency packaging. The interconnection device comprises an HTCC-based signal input module, a soft substrate module, a PIN transmission module and a signal output module, the signal input module is connected with the PIN transmission module through the soft substrate module, the PIN transmission module is connected with the signal output module, a signal is input through the signal input module, and the signal output module is connected with the soft substrate module. And the signal is sequentially transmitted by the soft substrate module and the PIN transmission module and then is output by the signal output module. The interconnection device has the advantages of being high in stability, convenient to use, good in heat dissipation effect and the like. 本发明公开了一种基于HTCC的陶瓷互联装置，涉及射频封装技术领域。所述互联装置包括基于HTCC的信号输入模块、软基板模块、PIN针传输模块以及信号输出模块，所述信号输入模块通过所述软基板模块与所述PIN针传输模块连接，所述PIN针传输模块与所述信号输出模块连接，信号经所述信号输入模块输