Double-sided heat dissipation packaging module and manufacturing method

The invention provides a double-sided heat dissipation packaging module and a manufacturing method, and the method comprises the steps: providing a lower heat conduction substrate, and fixing a to-be-packaged chip on the upper surface of the lower heat conduction substrate; a bonding supporting fram...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG ZHANQI, ZHU BENHUA, ZHANG XIANGDONG, LIU JIANGUO, ZHANG XIANGQIAN, SHI JIAYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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