Double-sided heat dissipation packaging module and manufacturing method

The invention provides a double-sided heat dissipation packaging module and a manufacturing method, and the method comprises the steps: providing a lower heat conduction substrate, and fixing a to-be-packaged chip on the upper surface of the lower heat conduction substrate; a bonding supporting frame is formed on the upper surface of the lower heat conduction substrate, the bonding supporting frame is located on the side edge of the to-be-packaged chip, the bonding supporting frame is of a trapezoidal bridge type structure, the end of the bonding supporting frame is in bonding connection with the lower heat conduction substrate, and the top end of the middle of the bonding supporting frame is higher than the upper surface of the to-be-packaged chip in the vertical direction; providing an upper heat-conducting substrate, and welding the top end of the bonding support frame with the upper surface of the upper heat-conducting substrate; and forming a plastic package layer wrapping the lower heat conduction subst