Method for improving surface compactness of electrode after sintering of MLCC copper terminal electrode

A method for improving electrode surface compactness after sintering of an MLCC copper terminal electrode belongs to the technical field of MLCC capacitors, and comprises the following specific implementation steps: S1, 700g of grinding balls with the diameter of 0.75 mm are added into a grinding ta...

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Hauptverfasser: SUN FEI, SHEN MENGNAN, WANG DAOYU, CHU TINGTING, SHEN YU'E
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A method for improving electrode surface compactness after sintering of an MLCC copper terminal electrode belongs to the technical field of MLCC capacitors, and comprises the following specific implementation steps: S1, 700g of grinding balls with the diameter of 0.75 mm are added into a grinding tank of a planetary ball mill; s2, a sample obtained after copper end electrode sintering is added into a grinding tank of a star ball mill; s3, adding deionized water into the grinding tank, wherein the adding amount of the deionized water is 95% of the solvent of the grinding tank; s4, covering the grinding tank with a cover, and fixing the grinding tank on the planetary ball mill; s5, the planetary ball mill is operated under the operation condition of 35 Hz for 6 min; s6, cleaning the treated sample and the grinding ball in deionized water, and then drying by using a vacuumizing drying oven; and S7, the treated product and a grinding medium are distinguished through a separation ball. According to the method, the