Coating machine sample table control method and device and magnetron sputtering coating machine

The invention provides a film plating machine sample table control method and device and a magnetron sputtering film plating machine, and relates to the technical field of film plating machines, and the film plating machine sample table control method comprises the following steps: determining a current film plating sample; obtaining a target material plating sequence and corresponding coating time of the current coating sample; determining a coating rotation process based on the target material coating sequence and the corresponding coating time; and a sample table is controlled to rotate according to the coating rotation process, and coating of the current coating sample is completed. According to the invention, full-automatic start-stop control of the sample table during sample coating can be realized. 本发明提供了镀膜机样品台控制方法、装置及磁控溅射镀膜机，涉及镀膜机技术领域，镀膜机样品台控制方法包括：确定当前镀膜样品；获取所述当前镀膜样品的镀靶材顺序和相应的镀膜时间；基于所述镀靶材顺序和相应的镀膜时间确定镀膜转动流程；控制样品台按照所述镀膜转动流程进行转动，完成所述当前镀膜样品的镀膜。本发明可实现样品镀膜时样品台的全自动启停控制。